Huawei has announced a new approach to semiconductor production, saying it has developed a method that could help it bypass US restrictions on advanced chipmaking technology. The new Huawei chip technology comes as the company continues to face strict US sanctions that began in 2019. These restrictions limit Huawei’s access to key components, including advanced lithography machines used in high-end chip production. According to the company, the goal is to continue advancing chip performance even without access…